Tuesday, May 5, 2020

Infrastructures of E-Commerce Strategy-Free-Samples for Students

Question: Discuss about the Infrastructures of E-commerce strategy. Answer: Infrastructures of e-commerce strategy: E-commerce now emerges as a gigantic manner so that every organization is now addicted to using it in order to manage the profit. Amazon, one of the biggest online shopping companies, can be a great example regarding utilizing the e-commerce technology. There are some infrastructures behind the whole procedures, and some layers are also there which is essential to be understood. Basically e-commerce business depends on the website, mobile application development where the company can connect with the customers. Amazon is also using this technique where 4 layers such as network technology substrate, transport and representation standard, middleware service and application layer situated or intermingled together to facilitate the technology in hand of the customers. As the internet started the journey, ecommerce got interlinked with it, and network technology substrate allows the customers to get the all resources as much as possible. Amazon Company builds the communication through web site and mobile application where network technology substrate layer, which is composed of the telecommunication network, helps to connect the terminal. It is a bunch or collection of the terminal nodes (Cariou et al., 2017). When customers want to communicate with the websites all these nodes enables message-switching, circuit switching to transfer the signals via correct links and nodes to derive the information. In the next layer, which is the transport and representation standard consists of TCP/IP protocol, is the set of rules or principle which allows one network to connect numbers of end users or numerous interconnected networks. The connection is made in this layer which allows the network technology substrate to get all the information available for the customers (Da Xu, He Li, 2014). Amazon Company using their portal by utilizing this two layers which are involved in connecting and building the networks. With the help of the internet, customers are now using all the resou rces at a time, and network technology substrate and transportation layer help to build and transport the information to the customers. Interlink between this two layers allow the middleware layer to perform in this part. Middleware layer just acts like glue which helps two layers to facilitate their works properly. It is basically a software through which all the information are performed or can be expressed to the customers. Middleware is the third party involvement, which helps to organize the databases between client end and company end and this is generally used to add the diversified software programs and enables them to talk or connect to each other (Nori et al,. 2016). All this procedures and layers ultimately get their destination or shape through the application layer, which is mainly the software or application. Customers use this layer or application to derive all the information, which they want. Application is the last layer where all the above three layers collected or are structured one by one to facilitate the information to their customers (Karagiannis et al,.2015). Amazon Company is using this infr astructure layer in their e-commerce business to allow the clients in order to promote their products or services References: Cariou, M., Potelon, B., Quendo, C., Cadiou, S., Schlaffer, E., Pessl, W., Le Fevre, A. (2017). Compact $ X $-Band Filter Based on Substrate Integrated Coaxial Line Stubs Using Advanced Multilayer PCB Technology.IEEE Transactions on Microwave Theory and Techniques,65(2), 496-503 Da Xu, L., He, W., Li, S. (2014). Internet of things in industries: A survey.IEEE Transactions on industrial informatics,10(4), 2233-2243. Karagiannis, V., Chatzimisios, P., Vazquez-Gallego, F., Alonso-Zarate, J. (2015). A survey on application layer protocols for the internet of things.Transaction on IoT and Cloud Computing,3(1), 11-17.. Nori, A. K., Shukla, D., Christensen, Y., Krishnaprasad, M., Sedukhin, I. (2016).U.S. Patent No. 9,336,060. Washington, DC: U.S. Patent and Trademark Office.

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